Mirtec MS-11 3D Solder Paste Inspection SPI (2011)

Description

Mirtec MS-11 3D Solder Paste Inspection SPI
Mirtec MS-11 3D Solder Paste Inspection SPI (2011)
Model: MS-11
Vintage: 2011
Qty Available: 2
2D Phase Step Image Processing
High Speed Precision In-Line SPI System
Four Mega Pixel Digital Camera Technology
Precision Telecentric Compound Lens Design
10 Micron / Pixel Resolution
2 Micron Height Accuracy
Volume Repeatability +/- 2%
Advanced Dual Probe Shadow Free Design
Superior Solder Profile Characterization
Three Stage High Speed Conveyor System
Automatic Gerber Import Software
Max PCB Size: 20.1” x 18.1”
Min PCB Size: 2.0” x 2.0”
Complete & Operational
Bundle Pricing Available For Both Units Together
Shipping/Logistics
Skidding Fee: 5
Crating Fee: 5
Barrier Bag/Vacuum Sealed: Upon Request
LEL Ships Domestically & Internationally
LEL will provide freight quotes upon request (Dedicated and LTL)
LEL recommends Dedicated Freight
Buyer assumes all responsibilities if shipped LTL
Most equipment ships within 72 hours of receiving fully cleared payment of purchase & logistics costs.
Equipment ships M-F and does not ship on all major US holidays and weekends.
Terms/Conditions
Equipment is sold "AS-IS" with no returns. Please see all photos and descriptions for condition of the equipment, additionally photos may be available upon request. Please ask any and all questions regarding listing before committing to purchase.